CANGAS™ features are such that they afford the customer flexibility in installation and reliability in overall performance.

The key features are:

• Low power (no heating), high sensitivity
• Small footprint
• Fast response time
• Wafer level element fabrication.
• Wafer level or individual element sensing film application
• Temperature stable quartz membrane
• Applicable to numerous applications using polymer, metal, and oxide sensing films
• Easily configured for sensor array
• “Static bending” mode of operation
• Concepts are applicable to thin film piezoelectric on silicon-based MEMS structures.
• Patents Pending